Global Semiconductor Assembly & Testing Services Market To Reach - Erie News Now | WICU & WSEE in Erie, PA

Global Semiconductor Assembly & Testing Services Market To Reach US$ 39,000 Million By 2021

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The global semiconductor assembly & testing services market is expected to reach US$ 39,000 million by 2021, registering a compound annual growth rate (CAGR) of 4.5% during the forecast period. The growing requirement for mobility and connectivity in customer electronic products and rising demand for higher electronic systems in automobiles are expected to drive the market. In addition, increasing technological advancement is expected to fuel the growth of the semiconductor assembly & testing services market. However, the regulations regarding the use of environmentally-friendly products, fluctuations in exchange rate, and flux in the market are expected to hamper the growth of the market.

In this report, the global semiconductor assembly & testing services market is segmented by service, application, and region. On the basis of service, the market is segmented into assembly & packaging services and testing services. The assembly & packaging services segment is subdivided into wafer level packaging, copper wire and gold wire bonding, flip chip, copper clip, and TSV. The market on the basis of application is segmented into automotive electronics, industrial, consumer electronics, computing & networking, and communication.

The global semiconductor assembly & testing services market is segmented on the basis of key regions, namely, North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa. Furthermore, each region is segmented to provide market revenue for select countries such as the U.S., Canada, the U.K., Germany, China, Japan, India, Russia, Brazil, and GCC countries.The report includes a detailed study of global and regional semiconductor assembly & testing services market and analyzes the variations in the growth of the industry in certain regions.

ASE Group, Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd., Powertech Technology Inc., CORWIL Technology Corporation, Psi Technologies Inc. (IMI), Global Foundries, and Chipbond Technology Corporation are the most active players in the semiconductor assembly & testing services market.

A glimpse of the report structure is provided in the report description available on the website.

https://www.marketresearchengine.com/reportdetails/semiconductor-assembly-and-testing-services-market

This report covers the semiconductor assembly & testing services market, in terms of value, and forecaststhe market size till 2021. It includes the market segmentation by service, application, and region. In addition, the report identifies key growth segments and opportunities in the industry. This report also covers detailed competitive outlook including the share and company profiles of the key players in the global market. Company profile includes company summary, financial summary, business strategy and planning, SWOT analysis, and current developments.

This deep-dive study on the semiconductor assembly & testing services market will help customers identify new market opportunities and targeted promotional plans.

 

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Source: http://www.financeswire.com/global-semiconductor-assembly-testing-services-market-to-reach-us-39000-million-by-2021

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